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Technology

Substrate Packaging
- LGA
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Lead Frame Packaging
Technology
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Technology

Finger Print Sensor
System In Package
Au/Cu/Ag Alloy Wire Bonding

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Tel: +0886-18605288499 （Helios Xia） E-mail:helios.xia@microbonding.cn

Address: No.29,Buyue Rd, Pukou Economic Development Zone,Nanjing,211800 P.R.China Power by:Hua Ke